Method for kinetically controlled etching of copper

Details Method for kinetically controlled etching of copper Method for kinetically controlled etching of copper

2011-07-12

2011-07-12

Olsen, Allan (Department: 1716)

Compositions

Etching or brightening compositions

C216S106000

Reexamination Certificate

active

07976723

ABSTRACT:
An etching composition, particularly for kinetically controlled etching of copper and copper alloy surfaces; a process for etching copper and copper alloys, particularly for etching at high rates to provide uniform and smooth, isotropic surfaces; an etched copper or copper alloy surface obtained by the process; and a process for generating copper or copper alloy electrical interconnects or contact pads. The etching composition and etching processes provide a smooth, isotropic fast etch of copper and copper alloys for semiconductor fabrication and packaging.

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