Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1977-11-03
1979-04-24
Massie, Jerome W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29628, 156215, 156272, 156295, 156267, 156304, 156330, 156331, 350 962, B65H 6902, G02B 514
Patent
active
041510305
ABSTRACT:
Dielectric optical waveguides are joined using a length of tape. One end of the tape is formed into a loop and the ends of two optical waveguides to be joined inserted into opposite sides of the loop. The diameter of the loop is reduced to such an extent that the waveguides cannot be moved alongside one another. The ends of the waveguides are moved together and the loop drawn tightly around the waveguides and secured in position. The diameter of the loop can be reduced using a pair of juxtaposed rollers. The ends of the waveguides can be secured together by suitable adhesive.
REFERENCES:
patent: 2990309 (1961-06-01), Wahl et al.
patent: 3455625 (1969-07-01), Brumley et al.
patent: 3708611 (1973-01-01), Dinger
patent: 3760524 (1973-09-01), Butler et al.
patent: 3810802 (1974-05-01), Buhite et al.
patent: 3857745 (1974-12-01), Grausch et al.
patent: 3871932 (1975-03-01), Langenberg
patent: 3899807 (1975-08-01), Sovish et al.
patent: 3916517 (1975-11-01), Luongo
patent: 3919037 (1975-11-01), Miller
patent: 3959052 (1976-05-01), Stanek
patent: 4023589 (1977-05-01), Rejeski
patent: 4034152 (1977-07-01), Warner
patent: 4057448 (1977-11-01), Miller
patent: 4070044 (1978-01-01), Carrow
Massie Jerome W.
The Post Office
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