Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2000-06-09
2003-02-25
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
Using high frequency vibratory energy
C156S073100
Reexamination Certificate
active
06523734
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a method for joining wiring boards each having a thin resin base plate suitable for instant connection with a reduced cost, a method for manufacturing a data carrier readable by electromagnetic waves which serves as an aviation tag, a label for transportation management, a non-clerk attendant gate pass, and a device for mounting an electronic module on a body of the data carrier.
2. Description of the Related Art
According to the progress of an electronics device such as a card type electronic device, a portable telephone or an image device, recently it has become necessary that a printed circuit board, particularly a flexible printed circuit board, may be made at a reduced cost. Accordingly, a joining unified technique in flexible thin printed circuit plates
10
and
20
, particularly an electrical connection between conductive patterns
12
and
22
on each wiring plate, as shown in
FIGS. 12 and 13
is required to be performed at a reduced cost.
Several conventional methods have been introduced for joining printed circuit boards
10
and
20
providing conductive patterns
12
and
22
formed respectively over one surfaces of insulating base members
14
and
24
.
According to a first conventional method, printed circuit boards
10
and
20
are joined each other by bonds such as epoxy bonding material, through-holes are made penetrating joining points
13
and
23
which are join predetermined portions, and insides of the through holes are electrically connected by metal conductive plating (such as a copper Cu) formed thereon, whereby multiple layer printed circuit boards are produced.
According to a second conventional method, at least one of the connection points
13
and
23
on the printed circuit boards
10
and
20
is applied by screen print with conductive bonds spread by conductive powder such as silver Ag into thermosetting property bonds, the connection points
13
and
23
are confronted each other and put together to be joined by heat-treatment with a proper pressure. Joining at a connection point
30
is performed by the above-mentioned conductive bond, but portions other than the connection point are connected by insulating bonds such as epoxy bonds, whereby the mechanical strength is increased.
According to a third method which is proposed in view of deletion of the process of the application of electrical conductive bonds and thermosetting property in the above-mentioned second method or reduction of cost by reducing the processing time, a previously formed connection sheet is inserted between connection points
13
and
23
of the printed circuit boards
10
and
20
to be heat pressure welded for connecting the connection points
13
and
23
. The connection sheet is provided with a circuit formed by conductive paint and thermoplasticity bond paint thereon applied on polyester film (PET), and inserted between the connection points
13
and
23
to be heat-pressure welded, whereby the thermoplasticity bond is melted and the connection point
13
subsequently comes into contact with a conductive paint circuit and the connection point
23
, so that the thermoplasticity bond is hardened by cooling the same to complete the connection process. In this method, the process of application by the conductive bond to the printed circuit boards
10
and
20
is unnecessary, and the connection time may be reduced by employing the thermoplasticity bond.
These conventional methods, however, have several disadvantages. In the first and second conventional methods, there are many processes of bonding-material application, plating, and heat treatment which need other connection member such as bonding material, plating metal, and electroconductivity bonding-material, resulting into cost increase. The connection process becomes very difficult after the electronic components
11
and
21
are mounted on the printed circuit boards
10
and
20
.
The third method may ease the process after mounting the electronic parts resulting into reduction of the process time, but the manufacturing cost may not be preferably reduced because of the necessity of other member such as the connection sheet.
SUMMARY OF THE INVENTION
It is, therefore, a primary object of this invention to provide an improved method for joining wiring boards each other, which may be performed by a reduced cost and applied to the boards assembled by electronic components, and the processing time which may be reduced.
According to a first aspect of this invention, there is provided a method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting the first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to the ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.
According to this method, any separate member such as glues is not necessary for connection and processing time is extremely short, thereby reducing the joining work cost and the device cost. Moreover, the application area is limited to a peripheral of the connection points, thereby simplifying a connection process of the printed wiring boards after assembled by electronic components. The connection process is free from wetness with separate glue member, incomplete connection, thereby enabling connection between conductors of different metals such as copper (Cu) and aluminum (Al).
According to a second aspect of this invention, there is provided a method as set forth in the first aspect of this invention for joining the wiring boards, in which a plurality of projections each having an end face shape corresponding to a desired welding portion shape are disposed on at least one of opposite end faces of the pair of ultrasonic welding tools, further including the steps of partially removing a conductive metal due to plasticity flow of the metal when an ultrasonic vibration is applied by the projections, and welding plastics exposed by the removed portion.
According to this method, after metal conductors of a printed wiring board composed of insulating resins and the metal conductors are welded by ultrasonic vibrations, the conductive metal is partially removed by employing plasticity flow of metal by the ultrasonic vibrations, and the exposed plastic members are welded. Accordingly, the electrical connection between conductive patterns is executed by metal welding, and the mechanical strength of the connection is sufficiently ensured by plastic members and welding. The above-described effects of the ultrasonic may be found in the connection between metal foils.
According to a third aspect of this invention, there is provided a method for manufacturing a film-type data carrier by joining an electronic component module in which a conductive pattern is adhered on a surface of a film-type resin small piece and electronic components, providing a transmission and reception circuit, and a memory mounted thereon, to a data carrier body having a spiral conductive pattern providing an antenna adhered on a surface of a film-type resin base plate, to be unified to ensure an electrical conduction for reading electromagnetic waves, including the steps of putting the film-type resin base plate of the data carrier body and the film-type resin small piece of the electronic component module together in a face-to-face relationship to adjust join predetermined portions on the conductive patterns, catching the adjusted join predetermined portions by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to the ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.
Accordin
Kawai Wakahiro
Okada Masanobu
Dickstein , Shapiro, Morin & Oshinsky, LLP
Dunn Tom
Johnson Jonathan
Omron Corporation
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