Method for joining resistive and conductive materials

Details Method for joining resistive and conductive materials Method for joining resistive and conductive materials

1974-12-13

1976-03-16

Truhe, J. V.

Electric heating

Metal heating

For bonding with pressure

219 85, 219 91, B23K 1120

Patent

active

039447774

ABSTRACT:
A method for joining, by molecular diffusion, an element of greater electrical resistance to a surface of substantially lesser electrical resistance. A piece of resistive material capable of being spot welded to the element of greater electrical resistance is placed in contact with both the surface having substantially lesser electrical resistance and the element having the greater electrical resistance. The resistive piece and the resistive element are spot welded to each other, whereby the heat from that spot weld causes the conductive material to be joined to the piece of resistive material by molecular diffusion. The method is particularly useful for joining nichrome wire to copper-clad printed circuit boards and for joining metal fasteners to copper and aluminum sheet metal surfaces.

REFERENCES:
patent: 1056061 (1913-03-01), Rogers
patent: 1568080 (1926-01-01), Meadowcroft
patent: 3231710 (1966-01-01), Barnet et al.
patent: 3381081 (1968-04-01), Schalliol
patent: 3666913 (1972-05-01), Haefling et al.

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