Method for joining porous metal structures and structure...

Details Method for joining porous metal structures and structure... Method for joining porous metal structures and structure...

2006-08-08

2006-08-08

Shaw, Clifford C. (Department: 1725)

Electric heating

Metal heating

Nonatmospheric environment at hot spot

C219S121460, C219S121640, C219S1370WM

Reexamination Certificate

active

07087853

ABSTRACT:
A method for joining weldable metal structures and compound structure formed using the method are disclosed herein. The method includes steps of abutting a first structure to a second structure along an edge to form a seam. The two structures are then welded together along the seam on one side of the structures through at least 75% of the thickness of the structures. The structures are then welded along a portion of the seam from the opposite side of the structures. The method may be used to join porous weldable metal structures. The method may be used to create a compound structure having very narrow weld seam widths.

REFERENCES:
patent: 3680584 (1972-08-01), Pierart
patent: 3707617 (1972-12-01), Rutter et al.
patent: 4459062 (1984-07-01), Siebert
patent: 4621181 (1986-11-01), Lachmitz
patent: 5672284 (1997-09-01), Devanathan et al.
patent: 5990446 (1999-11-01), Zhang et al.
patent: 0 454 861 (1991-11-01), None
patent: 0 589 585 (1994-03-01), None
patent: 0 852 984 (1998-07-01), None
patent: WO 99/21677 (1999-05-01), None
“Welding Handbook, vol. 3, 8thedn.” 1996, American Welding Society, Miami, FL 33126, XP002312251 p. 30-p. 41; figures 1.3, 1.6.

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