Superconductor technology: apparatus – material – process – High temperature – per se – Copper containing
Reexamination Certificate
2006-02-21
2006-02-21
Kopec, Mark (Department: 1751)
Superconductor technology: apparatus, material, process
High temperature , per se
Copper containing
C505S234000, C505S925000, C427S062000, C428S930000
Reexamination Certificate
active
07001870
ABSTRACT:
The present invention provides a method for joining an RE123 oxide superconductor matrix obtained by a melt process by the use of a solder material. The (110) plane of an RE123 oxide superconductor matrix obtained by a melt process is used as the plane to be joined, a solder material composed of an RE123 oxide superconductor having a lower melting point than the above-mentioned RE123 oxide superconductor is interposed between the planes to be joined, and this solder material is melted and then solidified to form a joining layer, thereby joining the matrices. The solder material can be a sinter, a melt-processed material, a powder, a slurry, or a molded powder.
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Iida Kazumasa
Murakami Masato
Sakai Naomichi
Yoshioka Junko
Flynn ,Thiel, Boutell & Tanis, P.C.
International Superconductivity Technology Center, The Juridical
Kopec Mark
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