Method for joining members at ordinary temperature

Details Method for joining members at ordinary temperature Method for joining members at ordinary temperature

1998-03-16

1999-10-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

2282343, B23K 2000, B23K 2022, B23K 20233

Patent

active

059674024

ABSTRACT:
When a metal member and a ceramic member are joined to one another, an aluminum nitride sintered compact is prepared. A liquid and a component which is mutually reactive with the liquid are applied onto the aluminum nitride sintered compact, and then a copper foil is laminated thereon. Subsequently, when the members are left to stand at room temperature, the liquid and the component mutually cause an exothermic reaction. The aluminum nitride sintered compact and the copper foil mutually diffuse, and they are tightly joined to one another. Accordingly, the members to be joined are not thermally affected, and a desired joining strength can be obtained by using simple equipment.

REFERENCES:
patent: 5273942 (1993-12-01), McCauley et al.
patent: 5812925 (1998-09-01), Ecer
patent: 5858144 (1999-01-01), Barton et al.

Affiliated with

Also associated with

Rating

Method for joining members at ordinary temperature does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for joining members at ordinary temperature, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for joining members at ordinary temperature will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2045898