Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-03-15
2005-03-15
Haran, John T. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S295000, C029S830000, C438S455000
Reexamination Certificate
active
06866741
ABSTRACT:
A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.
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Tummala, Editor, “Microelectronics Packaging Handbook”, 1997, Forward, pp. III-164-169, II-670-677, International Thompson Publishing, Florence, Kentucky.
Beilin Solomon I.
Chan Albert W.
Lee Michael G.
McCormack Mark Thomas
Haran John T.
Sheppard Mullin Richter & Hampton LLP
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