Method for joining adhesive tape to semiconductor wafer,...

Details Method for joining adhesive tape to semiconductor wafer,... Method for joining adhesive tape to semiconductor wafer,...

2007-07-27

2010-12-28

Nguyen, Khanh (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S538000

Reexamination Certificate

active

07857029

ABSTRACT:
An annular convex portion is formed along an outer periphery of a back face of a wafer so as to surround a ground area in the back face. The wafer is placed on a holding table with its front face directed upward. A locking member of the holding table supports and contacts the outer periphery of the annular convex portion, thereby securing the wafer. In this state, a separating adhesive tape is supplied toward a surface of a protective tape joined to the front face of the wafer. Then, a joining member presses the adhesive tape against the wafer, thereby joining the adhesive tape to the surface of the protective tape. Further, a guide member guides the adhesive tape joined to the protective tape in a reverse direction, Thus, the adhesive tape and the protective tape are simultaneously separated from the front face of the wafer.

REFERENCES:
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patent: 7559826 (2009-07-01), Sekiya
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patent: 2005/0126694 (2005-06-01), Yamamoto
patent: 2006/0181098 (2006-08-01), Iida
patent: 2002-124494 (2002-04-01), None

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