Method for joining a semiconductor chip to a chip carrier

Details Method for joining a semiconductor chip to a chip carrier Method for joining a semiconductor chip to a chip carrier

1982-07-29

1988-05-24

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156196, 219121LF, 219121LL, 427 531, B29C 6516

Patent

active

047463902

ABSTRACT:
Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting the energy of the laser beam to produce depressions by localizing melting of the semiconductor material of the chip and to at least partially pile melted semiconductor material at the edge of the depression, and applying cement or solder between the treated area of the semiconductor chip and the carrier.

REFERENCES:
patent: 3945111 (1976-03-01), Greeson et al.
patent: 4028523 (1977-06-01), Anderl et al.
patent: 4050507 (1977-09-01), Chu et al.
patent: 4200382 (1980-04-01), Friedman
patent: 4257827 (1981-03-01), Schwuttke et al.
patent: 4288678 (1981-09-01), La Rocca
patent: 4360965 (1982-11-01), Fujiwara
Levy et al., "Interfacial Bonding of Nickel to Polyamide-Imide", 6/79, pp. 68-71.
IEEE-Spectrum, May 1978, pp. 42-49.

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