Method for isolating self-aligned contact pads

Details Method for isolating self-aligned contact pads Method for isolating self-aligned contact pads

2005-02-22

2005-02-22

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

With measuring or testing

C438S299000, C438S626000, C438S694000, C438S008000

Reexamination Certificate

active

06858452

ABSTRACT:
A method for isolating SAC pads of a semiconductor device, including determining a chemical mechanical polishing process time necessary to isolate the SAC pads a desired amount by referring to a relationship equation between the extent of isolation of the self-aligned contact pads and the chemical-mechanical polishing process time. The chemical mechanical polishing process is performed for the determined process time on the semiconductor device to isolate the self-aligned contact pads the desired amount. The relationship equation is determined using a test semiconductor device.

REFERENCES:
patent: 6268252 (2001-07-01), Lee et al.
patent: 6274478 (2001-08-01), Farkas et al.
patent: 6432816 (2002-08-01), Kim et al.
patent: 6573173 (2003-06-01), Farkas et al.
patent: 20020036317 (2002-03-01), Matsui et al.
patent: 20020105088 (2002-08-01), Yang et al.
patent: 20020109171 (2002-08-01), Lee

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