Method for isolating circuit elements for semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 69, 437 26, 437982, 437947, H01L 2176

Patent

active

053428030

ABSTRACT:
Provided is a method for isolating circuit elements for effectively isolating devices on a semiconductor substrate from each other with use of a narrow insulating film. With such a method there is no likelihood of causing crystal defect in the semiconductor substrate or of deterioration in function of the channel stop of a channel stop region upon formation of the insulating film. The method for isolating circuit elements of the present invention includes steps of forming an insulating film over a semiconductor substrate, selectively removing the insulating film on a region to be an active region by etching to form a field insulator film, and implanting through the field insulator film ion of an impurity for preventing inversion of the conductivity type of the substrate into a region just under the field insulator film and adjacent to the surface of the substrate so as to form a channel stop region.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for isolating circuit elements for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for isolating circuit elements for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for isolating circuit elements for semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-29860

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.