Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-12-18
1995-11-07
Utech, Benjamin
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 97, 427 98, 4274301, 4274431, B05D 512
Patent
active
054646537
ABSTRACT:
A method for interconnecting a multilayer metal network of an electronic circuit board is provided. In the method, the electronic circuit board is made up of a plurality of superimposed metal layers having an insulating layer disposed therebetween, wherein the material of the insulating layer is substantially inert to a catalytic activation bath and to chemical deposition of metal. A via hole is formed in the board having a first metal layer thereof as its bottom and traversing a second metal layer and using electroless deposition, metal is deposited in the via by growing the metal from the metal layers only.
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Chantraine Philippe
Zorilla Marta
Bull S.A.
Kondracki Edward J.
Utech Benjamin
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