Method for interconnecting multi-layer printed circuit board

Details Method for interconnecting multi-layer printed circuit board Method for interconnecting multi-layer printed circuit board

2008-01-22

2008-01-22

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S842000, C174S261000, C216S018000, C427S097100

Reexamination Certificate

active

07320173

ABSTRACT:
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.

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Chinese Office Action dated Apr. 14, 2006 (with English Translation).

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