Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Patent
1994-05-31
1997-01-07
Ramsey, Kenneth J.
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
228 563, 22818022, 228246, H01L 2160
Patent
active
055910378
ABSTRACT:
In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.
REFERENCES:
patent: 4655382 (1987-04-01), Wong et al.
patent: 4737112 (1988-04-01), Jin et al.
patent: 4820376 (1989-04-01), Lambert et al.
patent: 4902857 (1990-02-01), Cranston et al.
patent: 5323947 (1994-06-01), Jusky et al.
Manko Soldering Handbook for Printed Circuits and Surface Mounting Van Nostrand Reinhold, New York 1986 pp. 178-181, 198-205.
Jin Sung-ho
McCormack Mark T.
Books Glen E.
Lucent Technologies - Inc.
Ramsey Kenneth J.
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