Method for interconnecting a flip chip to a printed circuit subs

Details Method for interconnecting a flip chip to a printed circuit subs Method for interconnecting a flip chip to a printed circuit subs

1996-05-10

1997-04-01

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

22818022, 361743, 361764, H05K 334

Patent

active

056154771

ABSTRACT:
A printed circuit assembly and a method of manufacturing therefor are provided for directly connecting unpackaged integrated circuit chips such as flip chips to a footprint of active contact pads on a printed circuit substrate. A reduction in packaging density is obtained by electrically interconnecting one or more of the active contact pads with circuit traces formed on different layers of the printed circuit substrate. In a preferred embodiment, at least one of the active contact pads includes an electrically conductive through hole electrically connecting the contact pad and a circuit trace located on the back side of a double-sided printed circuit substrate. In another embodiment, the printed circuit substrate is a multilayer construction, which enables active contact pads to be electrically interconnected with circuit traces on a plurality of circuit layers.

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