Method for integrating pre-fabricated chip structures into...

Details Method for integrating pre-fabricated chip structures into... Method for integrating pre-fabricated chip structures into...

2008-03-04

2008-03-04

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000

Reexamination Certificate

active

10974006

ABSTRACT:
A method for manufacturing integrated objects, e.g., electronic devices, biological devices. The method includes providing a holder substrate, which has at least one recessed region, the recessed region having a predetermined shape. The holder substrate has a selected thickness and is characterized as being substantially rigid in shape. The method includes aligning a chip comprising a face and a backside into the predetermined shape of the recessed region and disposing the chip into the recessed region. The chip is secured into the recessed region. The method includes providing a first film of insulating material having a first thickness overlying the face and portions of the holder substrate to attach the chip to a portion of the first film of insulating material and patterning the first film of insulating material to form at least one opening through a portion of the first thickness to a contact region on the face of the chip. The method includes forming a metallization layer overlying the first film of insulating material to couple to the contact region through the one opening and forming a protective layer overlying the metallization layer. The method includes releasing the chip from the holder substrate while maintaining attachment of the chip to the first film of insulating material.

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