Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-10-29
2010-06-29
Pham, Thanh V (Department: 2894)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S401000, C257SE21023
Reexamination Certificate
active
07745344
ABSTRACT:
A method for integrating Non-Volatile Memory (NVM) circuitry with logic circuitry is provided. The method includes depositing a first layer of gate material over the NVM area and the logic area of the substrate. The method further includes depositing multiple adjoining sacrificial layers comprising nitride, oxide and nitride (ARC layer) overlying each other. The multiple adjoining sacrificial layers are used to pattern select gate and control gate of memory transistor in the NVM area, and the ARC layer of the multiple adjoining sacrificial layers is used to pattern gate of logic transistor in the logic area.
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PCT/US2008/076750 International Search Report and Written Opinion mailed Apr. 10, 2009.
Freescale Semiconductor Inc.
Laurenzi, III Mark A
Pham Thanh V
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