Method for integrating microelectromechanical devices with elect

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device

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438 50, 438 52, 438200, 438691, H01L 2100

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active

057982830

ABSTRACT:
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.

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