Method for integrating an electronic component or similar...

Details Method for integrating an electronic component or similar... Method for integrating an electronic component or similar...

2008-07-08

2008-07-08

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

C438S422000, C438S424000, C438S435000, C438S627000, C257SE21499

Reexamination Certificate

active

07396739

ABSTRACT:
A method for integrating an electronic component or the like into a substrate includes following process steps: formation of a dielectric insulating layer on the front side of a substrate; complete back-etching of an area of the substrate from the back of the substrate to form a cavity; formation of a photoresistive layer with a homogeneous thickness over the back of the substrate; placement of an electronic component on the photoresistive layer formed in the cavity for adhesion of the electronic component to the photoresistive layer; removal of the formed photoresistive layer except for the area on which the electronic component adheres to the photoresistive layer in the cavity; and formation of a fixing layer over the back of the substrate to fix the electronic component in the cavity of the substrate.

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patent: 2003/0022397 (2003-01-01), Hess et al.
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patent: WO-01/24259 (2001-04-01), None

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