Method for integrated high Q inductors in FCGBA packages

Details Method for integrated high Q inductors in FCGBA packages Method for integrated high Q inductors in FCGBA packages

2005-12-06

2005-12-06

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C361S783000, C257S724000, C257S728000, C257S778000

Reexamination Certificate

active

06972965

ABSTRACT:
A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance and a predetermined length. The quality factor associated with the inductor is a ratio of the trace line's inductance to the trace lines resistance. The package substrate is a low loss laminate.

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