Method for integrated EMI shielding

Details Method for integrated EMI shielding Method for integrated EMI shielding

2005-03-15

2005-03-15

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C174S260000, C174S050510, C361S761000, C361S764000, C361S792000, C361S794000, C361S718000, C361S719000, C361S767000, C361S777000

Reexamination Certificate

active

06865804

ABSTRACT:
The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

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