Method for insuring soldered connections

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

228180A, 228904, B23K 2100

Patent

active

040906558

ABSTRACT:
Stripped wire ends are coated with a "solder friendly" resin such that when they are placed in physical contact with terminals during assembly of electrical circuitry preparatory to soldering the same to the terminals, there is no appreciable conduction. After a routine soldering operation, the resin melts and vaporizes so that a solid electrical connection results, the resin itself serving to inhibit oxidation of the soldered connection. When a routine quality control testing operation is carried out on the electrical circuitry, any overlooked soldered connections will be immediately indicated by non conduction or poor conduction of the unsoldered portions as a result of the presence of the resin. These overlooked unsoldered connections can thus be immediately corrected. In the absence of the resin, the routine quality control testing would indicate a proper connection merely because of the physical contact of the wire with the terminal even though not soldered.

REFERENCES:
patent: 2657458 (1953-11-01), Passel
patent: 3662454 (1972-05-01), Miller
patent: 3763545 (1973-10-01), Spanjer
patent: 4013212 (1977-03-01), Miller
patent: 4028143 (1977-06-01), Stayner

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for insuring soldered connections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for insuring soldered connections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for insuring soldered connections will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-560638

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.