Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1997-01-30
1999-01-26
Ryan, Patrick
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228103, B23K 3112
Patent
active
058629734
ABSTRACT:
A method is available for inspecting a printed circuit board and solder paste deposited upon the printed circuit board, whereby both systematic defects occurring during a solder paste deposition process and random defects are located. The printed circuit board is continuously scanned by an inspection head immediately following the solder paste deposition process. Images of the printed circuit board are then analyzed for random defects such as missing solder paste, improper solder paste coverage, and solder bridging. Next, heights of solder paste deposits are sampled. A pattern of light is projected upon selected solder paste deposits, and images of the selected solder paste deposits are captured. Light triangulation techniques are then used for determining the height of each selected solder paste deposit. Variations in the height of solder paste are systematic defects occurring in the solder paste deposition process.
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Gamache Richard E.
Knapp Jeffrey T.
Ryan Patrick
Teradyne, Inc.
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