Method for inspecting silicon wafer, method for...

Details Method for inspecting silicon wafer, method for... Method for inspecting silicon wafer, method for...

2005-03-01

2005-03-01

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Reexamination Certificate

active

06861268

ABSTRACT:
The present invention provides a method for inspecting a silicon wafer making it possible to identify and efficiently detect a new defect affecting a device fabricating process, a method for manufacturing a silicon wafer enabling manufacture of wafers not having the defect, a method for fabricating a semiconductor device using the silicon wafer not having this defect, and the silicon wafer not having the defect. When a silicon wafer is inspected, inspection is made for a defect having the entire defect size of 0.5 μm or more in which microdefects gather in a colony state.

REFERENCES:
patent: 6515742 (2003-02-01), Ruprecht
patent: 6673637 (2004-01-01), Wack et al.
patent: 05-017292 (1993-01-01), None

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