Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-06-06
2010-11-09
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S017000, C438S019000, C257SE21007, C257SE21207, C257SE21585, C257SE21599
Reexamination Certificate
active
07829355
ABSTRACT:
A method for inspecting a semiconductor device includes carrying out a first test for inspecting characteristics of semiconductor devices under a shielded (dark) condition to discriminate non-defective devices; and carrying out a second test on the semiconductor devices which have passed the first test as non-defective devices, for inspecting characteristics of the semiconductor devices. The second test is carried out while a predetermined color of light is applied to the semiconductor devices.
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Lebentritt Michael S
Oki Semiconductor Co., Ltd.
Volentine & Whitt P.L.L.C.
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