Method for inspecting printed circuit boards with through-holes

Details Method for inspecting printed circuit boards with through-holes Method for inspecting printed circuit boards with through-holes

1991-04-09

1993-03-30

Harvey, Jack B.

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

324715, 324158R, 324537, G01R 2708, G01R 3102

Patent

active

051987783

ABSTRACT:
A method for inspecting a printed circuit board having through-holes filled with conductive paste and having a pair of current measurement lands and a pair of resistance measurement lands. The pairs of current measurement lands and resistance measurement lands are used to measure voltage and current through the through-holes using the four-probe method, thereby preventing incomplete inspection of printed circuit boards and improving the dependability of tests on the packing conditions of the conductive paste in the through-holes.

REFERENCES:
patent: 3766470 (1973-10-01), Hay et al.
patent: 3781683 (1973-12-01), Freed
patent: 4675600 (1987-06-01), Gergin

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