Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Reexamination Certificate
2005-04-20
2008-08-05
Smith, Matthew S. (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
C438S015000, C257SE21521, C257SE21524, C257SE21526
Reexamination Certificate
active
07407822
ABSTRACT:
The invention provides an inspection apparatus and an inspection method for detecting defects, a punching apparatus, and a method for controlling a punching apparatus, for the purpose of immediate detection of debris from being lifted toward the surface of an insulating film for film carrier tape, which debris tends to occur during punching of the insulating film for film carrier tape by use of a punching mold, whereby the number of pieces having defects on the film surface caused by attachment of debris from being lifted or foreign matter is reduced to a minimum possible number. In the present invention, an insulating film for film carrier tape is irradiated with parallel rays having passed through a first polarizing filter, the insulating film having been punched and being conveyed; the rays having passed through or having been reflected by the insulating film for film carrier tape is caused to pass through a second polarizing filter; the rays having passed through the second polarizing filter, is received by means of an image pickup device; and the image input to the image pickup device is subjected to image processing as a difference of brightness, whereby defects of the insulating film for film carrier tape are detected.
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Horiai Naoaki
Kato Kazuyoshi
Mitsui Mining & Smelting Co. Ltd.
Smith Matthew S.
Stark Jarrett J
Sughrue & Mion, PLLC
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