Method for inspecting crimp bonded terminals

Details Method for inspecting crimp bonded terminals Method for inspecting crimp bonded terminals

1983-10-24

1985-11-26

Boudreau, Leo H.

Image analysis

Histogram processing

For setting a threshold

250563, G06K 900

Patent

active

045557993

ABSTRACT:
In an improved method for inspecting crimp bonded terminals, instead of inspecting visually, contour images of crimp bonded terminals are picked up and scanned to provide necessary data and processing operations are performed on the data to make a decision automatically on the acceptance or rejection of the crimp bonded terminals, thereby elevating the inspection efficiency and improving the accuracy of deciding the acceptance or rejection of the crimp bonded terminals.

REFERENCES:
patent: 3112150 (1963-11-01), Hammell
patent: 4343553 (1982-08-01), Nakagawa et al.

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