Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2008-05-20
2008-05-20
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
C356S237400, C356S237500, C382S145000, C382S149000, C250S559270
Reexamination Certificate
active
10756770
ABSTRACT:
A method for inspecting an insulator with a library of optic images is disclosed. The method for inspecting an insulating layer according to the present invention, comprises the steps of collecting standard data for thickness of the insulating layer; collecting standard data for an optic image of the insulating layer; making a library by matching standard data for the thickness and the optic image; and inspecting the insulating layer with the library. Thus, the method of inspecting an insulating layer by using the thickness and the library of optic images in the present invention can considerably improve the conventional methods that depend only on the thickness or the optic images by making the thickness and the optic image for the part or whole of the wafer into a form of data, matching them, and making a library of them. Because the lack of wafer representative due to the restriction of monitoring pattern is overcome and the wafer representative is improved, monitoring the process and measuring the global planarization for wafer unit can be more accurate.
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Abstract and Figure Korean Patent, KR 2001001224 A, of Seo, S. R. published Jan. 5, 2001.
Dongbu Electronics Co. Ltd.
Pillsbury Winthrop Shaw & Pittman LLP
Stock, Jr. Gordon J.
Toatley , Jr. Gregory J.
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