Method for inspecting a semiconductor device

Details Method for inspecting a semiconductor device Method for inspecting a semiconductor device

1995-05-01

1996-10-22

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

348126, 348130, G01B 1100

Patent

active

055668771

ABSTRACT:
A method for inspecting a semiconductor device includes an inspection station (10), a handling system (12), a microscope (14), a camera (18), and a computer (20) having a monitor (22). A magnified image (40) of the device being inspected is transmitted to monitor (22) via camera (18). A template image (60) is then recalled from computer readable memory and is superimposed upon the magnified image of the device appearing on monitor (22). The template image (60) includes transparent regions (62) and opaque regions (64). The opaque regions block out all areas of the device not associated with the characteristic being inspected, while the transparent regions highlight the area of interest. Using the superimposed image (70), the operator can quickly focus on the area of the device requiring attention. In specific embodiments of the invention, a template is used to assist inspection of a wire bond configuration, a die attach material bondline, lead skew, and mark placement.

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patent: 5170062 (1992-12-01), Miyahara
patent: 5353356 (1994-10-01), Waugh et al.

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