Method for inspecting a populated printed circuit board, particu

Details Method for inspecting a populated printed circuit board, particu Method for inspecting a populated printed circuit board, particu

1992-08-06

1993-05-04

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

2503381, 250341, 324 731, G01R 3102, G01N 2171

Patent

active

052085287

ABSTRACT:
The invention relates to a method for inspecting a populated printed circuit board, particularly for inspecting the solder joints on the board, and advantageously usable for boards populated with surface-mount (SM) components. According to the invention, the inspection method comprises at least the following steps:

REFERENCES:
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patent: 3803413 (1974-04-01), Vanzetti et al.
patent: 3868508 (1975-02-01), Lloyd
patent: 4481418 (1984-11-01), Vanzetti et al.
patent: 4792683 (1988-12-01), Chang et al.
patent: 4965451 (1990-10-01), Solter
"Infrared Imaging Pins Down PC-Board Solder-Joint Faults", Electronic Design, vol. 28, No. 3, Feb. 1, 1980), (Rochelle Park, US).
"The Infrared Signature for PC Boards Maintenance", J. M. Konklin, et al, 28th Electronic Components Conference, Anaheim, Calif. Apr. 24-26, 1978, IEEE, (New York, US) pp. 286-289.
"New Concepts of Applying Thermographic Testing to Printed Circuit Boards and Finished Products", H. Boulton, Proceedings of the International Test Conference, Nov. 19-21, 1985, IEEE, (New York, US).
"Pinpointing Shorts with Color Thermography", K. Pomeroy, Electronic Tests, vol. 11, No. 6, Jun. 1988 (San Francisco, Calif., US), pp. 89, 90, 92.

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