Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1997-05-29
1999-06-01
Heinrich, Samuel M.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228105, 2281805, 382146, H01L 2160
Patent
active
059081503
ABSTRACT:
There is provided a method of bonding inner leads of lead frames to electrodes of semiconductor chips, including the steps of (a) pictorially recognizing bonding sites of inner leads a semiconductor chip through wires for the certain number of lead frames among a plurality of lead frames and analyzing the bonding sites to obtain coordinate data numerically expressing the bonding sites, (b) calculating statistic about dispersion in the thus obtained coordinate data, (c) judging whether the thus calculated statistic is smaller or greater than a predetermined threshold value, and (d) bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames in accordance with predetermined bonding site data without pictorially recognizing bonding sites thereof, if the statistic is equal to or smaller than the predetermined threshold value, or bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames by pictorially recognizing bonding sites in advance for the rest of lead frames, if the statistic is greater than the predetermined threshold value. In accordance with the above mentioned method, it is possible to omit pictorial recognition for the rest of lead frames, if statistic calculated based on dispersion in bonding sites in the certain number of lead frames is smaller than a threshold value, resulting in significant improvement in bonding speed.
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Heinrich Samuel M.
NEC Corporation
Stoner Kiley
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