Method for inhibiting oxidation of a copper film on ceramic body

Details Method for inhibiting oxidation of a copper film on ceramic body Method for inhibiting oxidation of a copper film on ceramic body

1982-06-17

1985-04-02

Bueker, Richard

Coating processes

Electrical product produced

Condenser or capacitor

427 79, 427123, 427250, 427255, 427335, 427377, 4274431, 427444, 148 1, 148 132, 148 614R, 148 631, 422 1, 422 40, 252388, 204192SP, 204192N, B05D 118, C23C 302, C23C 1302

Patent

active

045087563

ABSTRACT:
A method for inhibiting oxidation of copper electrodes of a ceramic capacitor, comprising the step of subjecting copper films formed by an electroless plating process or the like and serving as opposed electrodes of a ceramic capacitor to a hydrocarbon halide compound including trichloroethylene, perchloroethylene, freon, chlorobenzene, methyl chloride, methylene chloride, chloroform, carbon tetrachloride, or the like.

REFERENCES:
patent: 2298513 (1942-10-01), Rodgers
patent: 2349183 (1944-05-01), Mahler
patent: 2845366 (1958-07-01), Schroeder
patent: 2972570 (1961-02-01), Haas et al.
patent: 2978098 (1961-04-01), Post
patent: 3015576 (1962-01-01), Hendrixson et al.
patent: 3034921 (1962-05-01), Thompson
patent: 3035944 (1962-05-01), Sher
patent: 3073721 (1963-01-01), Pokorny
patent: 3254282 (1966-05-01), West
patent: 3416207 (1966-12-01), Maida
patent: 3531414 (1970-09-01), Randell et al.
patent: 3941720 (1976-03-01), Hoffmann et al.
patent: 4123562 (1978-10-01), Chandross et al.
Grunwald et al., Some Physical Properties of Electroless Copper Plating, 58, 1004, Oct. 1971.

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