Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-06-29
1999-12-28
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156256, 15624411, 492 46, 399328, 399330, 399333, B31C 1300, F28F 502, B29C 302, G03G 1520
Patent
active
060076577
ABSTRACT:
A method for increasing the thermal conductivity of a fuser member for use in electrostatographic, including digital, apparatuses, by orienting anisotropic fillers in an elastomer layer in a manner wherein heat transfer is maximized in a radial or tangential direction of the fuser member. The fuser member may also contain other optional fillers and optional fluorocarbon powder fillers.
REFERENCES:
patent: 4257699 (1981-03-01), Lentz
patent: 4763158 (1988-08-01), Schlueter, Jr.
patent: 4887340 (1989-12-01), Kato et al.
patent: 5012072 (1991-04-01), Martin et al.
patent: 5066517 (1991-11-01), Hanson et al.
patent: 5123151 (1992-06-01), Uehara et al.
patent: 5332641 (1994-07-01), Finn et al.
patent: 5349423 (1994-09-01), Nagato et al.
patent: 5458954 (1995-10-01), Ogi et al.
patent: 5614935 (1997-03-01), Ogi et al.
patent: 5631043 (1997-05-01), Ogi et al.
patent: 5729813 (1998-03-01), Eddy et al.
patent: 5744241 (1998-04-01), Hobson et al.
patent: 5765085 (1998-06-01), Law et al.
patent: 5773796 (1998-06-01), Singer et al.
Badesha Santokh S.
Eddy Clifford O.
Henry Arnold W.
Maliborski James B.
Blade Annette L.
Crispino Richard
Purvis Sue A.
Xerox Corporation
LandOfFree
Method for increasing thermal conductivity of fuser member havin does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for increasing thermal conductivity of fuser member havin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for increasing thermal conductivity of fuser member havin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2379836