Method for increasing deposition rates of metal layers from...

Coating processes – Coating by vapor – gas – or smoke – Metal coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S255700, C427S096800

Reexamination Certificate

active

10996145

ABSTRACT:
A method for increasing deposition rates of metal layers from metal-carbonyl precursors by mixing a vapor of the metal-carbonyl precursor with CO gas. The method includes providing a substrate in a process chamber of a deposition system, forming a process gas containing a metal-carbonyl precursor vapor and a CO gas, and exposing the substrate to the process gas to deposit a metal layer on the substrate by a thermal chemical vapor deposition process.

REFERENCES:
patent: 4851895 (1989-07-01), Green et al.
patent: 4929468 (1990-05-01), Mullendore
patent: 4938999 (1990-07-01), Jenkin
patent: 5171610 (1992-12-01), Liu
patent: 6303809 (2001-10-01), Chi et al.
patent: 6319832 (2001-11-01), Uhlenbrock et al.
patent: 6420583 (2002-07-01), Lienhard et al.
patent: 6440495 (2002-08-01), Wade et al.
patent: 6444263 (2002-09-01), Paranjpe et al.
patent: 6605735 (2003-08-01), Kawano et al.
patent: 6713373 (2004-03-01), Omstead
patent: 2003/0129306 (2003-07-01), Wade et al.
patent: 2004/0105934 (2004-06-01), Chang et al.
patent: 2005/0070100 (2005-03-01), Yamasaki et al.
patent: 2005/0081882 (2005-04-01), Greer et al.
patent: 2005/0110142 (2005-05-01), Lane et al.
patent: 2005/0186341 (2005-08-01), Hendrix et al.
patent: 0620291 (1994-10-01), None
patent: WO0026432 (2000-05-01), None
patent: WO2005034223 (2005-04-01), None
Czekaj, C. et al. “Inorganic Chemistry” 1988, 27, p. 8-10.
Wang et al., Low-temperature chemical vapor deposition and scaling limit of ultrathin Ru films, Applied Physics Letters, Feb. 23, 2004, pp. 1380-1382, vol. 84, No. 8, American Institute of Physics, Melville, NY.
European Patent Office, International Search Report and Written Opinion, Aug. 8, 2006, 9 pp.
European Patent Office, International Search Report and Written Opinion of corresponding PCT Application No. PCT/US2006/007675, dated Oct. 13, 2006, 9 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for increasing deposition rates of metal layers from... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for increasing deposition rates of metal layers from..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for increasing deposition rates of metal layers from... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3769929

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.