Method for incorporating a desiccant in a semiconductor package

Compositions – Radioactive compositions – Nuclear reactor fuel

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252194, 427 93, 427 82, H01L 2336

Patent

active

044279922

ABSTRACT:
A desiccant for semiconductor packaging which may be applied in liquid form consists essentially of approximately 60% by weight absolute ethyl alcohol, 25% by weight ethyl acetate, 5% by weight water, 5% by weight a source of boron, aluminum or phosphorus and 5% by weight of an organic silane having the structural formula: ##STR1## where R.sub.1 is a radical selected from the group consisting of H.sup.-, CH.sub.2 .dbd.CH.sup.-, CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, CH.sub.3 CO.sub.2 .sup.-, C.sub.2 H.sub.5 CO.sup.-, and C.sub.3 H.sub.7 O.sup.-, and R is a radical selected from the group consisting of CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, C.sub.3 H.sub.7 O.sup.-, CH.sub.3 CO.sub.2.sup.-, C.sub.2 H.sub.5 CO.sub.2.sup.-, Si.sup.+, OH.sup.-, and O.sup.-. The sources of boron, aluminum, and phosphorus may be halides, oxides or nitrates. Also a process for incorporating the foregoing into semiconductor package and process for formulating the above solution.

REFERENCES:
patent: 2683667 (1954-07-01), Utter
patent: 3528169 (1970-09-01), Pervin et al.
patent: 3586926 (1971-06-01), Nakamura et al.
patent: 3789023 (1974-01-01), Ritchie

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