Method for incorporating a carrier element

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156247, 156248, 156249, 156256, 156261, 156230, 156238, 257679, 283904, B32B 3118

Patent

active

055142400

ABSTRACT:
The invention relates to a method for incorporating a carrier element or module in a card body. The card body is provided with a recess shaped accordingly for incorporating the carrier element. The carrier element comprises a substrate on which an integrated circuit is disposed. Before the carrier element is incorporated a contact adhesive element is first introduced into the recess by means of a suitable tool. The carrier element can then be connected firmly and permanently with the card body with the aid of the contact adhesive element under the action of pressure.

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