Method for in situ removal of particulate residues resulting fro

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

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134 2, 134 19, 427309, B05D 300

Patent

active

060296801

ABSTRACT:
Disclosed is a process for cleaning silicon surfaces of native oxide films. The process utilizes fluorine containing cleaning materials such as anhydrous hydrofluoric acid to clean the oxide from the surface. A fluorine containing particulate matter which forms on the surface as a result of the fluorine containing cleaning materials is then removed by heating the surface to a high temperature. The process is conducted in a non-oxidizing ambient and is preferably conducted in a cluster tool so that the heating step can take place in the same chamber of the cluster tool as later metal deposition step.

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Sherman, "Chemical Vapor Deposition for Microelectronics," Noyes Publications, 1987, pp. 103-114.

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