Heating – Heating or heat retaining work chamber structure
Reexamination Certificate
2006-09-29
2008-11-04
Wilson, Gregory A (Department: 3749)
Heating
Heating or heat retaining work chamber structure
C219S448110, C430S330000, C356S237200
Reexamination Certificate
active
07445446
ABSTRACT:
A method of heat-treating resist coated manufacturing wafers in a processing system by establishing a temperature profile for each of a plurality of hotplates in the processing system, heat-treating the resist coated manufacturing wafers on the hotplates, obtaining CD metrology data from test areas on the heat-treated resist coated manufacturing wafers, determining CD variations for each hotplate from the CD metrology data, adjusting the temperature profile of one or more hotplates after determining the CD variations, and heat-treating additional resist coated manufacturing wafers on the hotplates after the adjusting.
REFERENCES:
patent: 6644965 (2003-11-01), Ookura et al.
patent: 6689519 (2004-02-01), Brown et al.
patent: 6806008 (2004-10-01), Schedel et al.
patent: 6891627 (2005-05-01), Levy et al.
patent: 6969829 (2005-11-01), Tsuruno et al.
patent: 6987572 (2006-01-01), Lakkapragada et al.
patent: 7101816 (2006-09-01), Kaushal et al.
patent: 7106433 (2006-09-01), Hasan
patent: 7187796 (2007-03-01), Phan et al.
patent: 7227628 (2007-06-01), Sullivan et al.
patent: 2002/0177094 (2002-11-01), Shirakawa
patent: 2002/0177245 (2002-11-01), Sonderman et al.
patent: 2003/0015493 (2003-01-01), Grasshoff et al.
patent: 2003/0186183 (2003-10-01), Ito et al.
patent: 2004/0241561 (2004-12-01), Chen et al.
patent: 2006/0024850 (2006-02-01), Monahan et al.
patent: 2006/0094131 (2006-05-01), Wang et al.
patent: 2006/0222975 (2006-10-01), Ke et al.
patent: 2006/0252000 (2006-11-01), Hayashi et al.
patent: 2007/0068453 (2007-03-01), Chen et al.
Ruck Kirsten
Weichert Heiko
Tokyo Electron Limited
Wilson Gregory A
Wood Herron & Evans LLP
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