Method for improving the thermal cycled adhesion of...

Details Method for improving the thermal cycled adhesion of... Method for improving the thermal cycled adhesion of...

2007-11-13

2007-11-13

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S257000

Reexamination Certificate

active

11111317

ABSTRACT:
An improved electrical printed circuit exhibiting a combination of enhanced solderability and outstanding adhesion with a dielectric substrate includes a stack of two different types of conductive films. The stack includes a first conductive film that is printed onto the substrate with an ink that has been specially formulated to achieve enhanced adhesion with the substrate, and a second film that is applied over the first film using an ink that has been specifically formulated to achieve enhanced solderability.

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