Method for improving the adhesion of metal films to polyphenylen

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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525132, 525185, B32B 3120

Patent

active

061653098

ABSTRACT:
The present invention is directed to a method for improving the adhesion between a conductive laminate and a substrate material. In a preferred embodiment of the present invention, the conductive laminate is a copper film and the substrate material comprises polyphenylene ether resin. The method involves admixing a copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride with the polyphenylene ether resin. The copolymer of a vinyl aromatic compound and an .alpha.,.beta.-unsaturated cyclic anhydride is preferably a polystyrene maleic anhydride copolymer or a rubber modified polystyrene maleic anhydride copolymer.

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