Method for improving the adhesion of a plastic encapsulant to co

Details Method for improving the adhesion of a plastic encapsulant to co Method for improving the adhesion of a plastic encapsulant to co

1989-03-14

1990-08-07

Woo, Jay H.

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

148276, 148284, 26427217, C23F 302, H01L 2148, H01L 2156

Patent

active

049465180

ABSTRACT:
The adhesion of plastic encapsulants to electrical leadframes containing substantial amounts of copper is improved by exposing the leadframes to an active oxygen ambient (e.g., 10-30% H.sub.2 O.sub.2) at temperatures below the leadframe annealing temperature (e.g., room temperature to 100.degree. C.) for a few minutes. There is no need to remove the native oxide. A preliminary degreasing step is desirable but not essential. The treatment strengthens any native oxide present on the leadframes without producing an oxide which is so thick as to interfere with subsequent bonding of electronic components or connecting wires to the leadframe. Delamination between the leadframe and the plastic encapsulant by temperture cycling from -65.degree. to 150.degree. C. is substantially reduced.

REFERENCES:
patent: 3434889 (1969-03-01), Haroldson
patent: 3992230 (1976-11-01), Komiyama
patent: 4328048 (1982-05-01), Senda
patent: 4534921 (1985-08-01), Fierkens
patent: 4582556 (1986-04-01), Butt
patent: 4641418 (1987-02-01), Meddles
patent: 4822550 (1989-04-01), Komathu

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