Method for improving step coverage of a metallization layer on a

Details Method for improving step coverage of a metallization layer on a Method for improving step coverage of a metallization layer on a

1990-08-31

1991-11-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437192, 437194, H01L 2126

Patent

active

050666118

ABSTRACT:
A method for improving step coverage of metallization layers of an aluminum alloy on an integrated circuit involves use of a deposited layer of molybdenum as an anti-reflective coating to increase the efficient use of laser energy for planarization purposes where the underlying aluminum alloy covers a step, such as an open contact hole or via.

REFERENCES:
patent: 4758533 (1988-07-01), Magee et al.
patent: 4800179 (1989-01-01), Mukai
Y. Lai et al., "The Use of Ti as an Antireflective Coating for Laser Planarization of Al . . . " 6th International IEEE VLSI Multilevel Interconnect Conference, Cat. No. 89-TH0259-2, Jun. 12-13, 1989, p. 501.
R. Liu et al., "A Study of Pulsed Laser Planarization of Al . . . ", 6th International IEEE VLSI Multilevel Interconnect. Conference, Cat. No. 89TH0259-2, Jun. 12-13, 1989 pp. 329-335.
D. B. Tuckerman et al., "Laser Planarization", Solid State Technology vol. 29, No. 4, Apr. 1986, pp. 129-134.

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