Method for improving etch uniformity during a wet etching proces

Details Method for improving etch uniformity during a wet etching proces Method for improving etch uniformity during a wet etching proces

1998-12-07

2000-09-26

Powell, William

Etching a substrate: processes

Nongaseous phase etching of substrate

Relative movement between the substrate and a confined pool...

216 99, 216101, 216104, 216107, 216109, 134 13, H01L 21302

Patent

active

061238651

ABSTRACT:
A method for improving etch uniformity during a wet etching process is disclosed. The method comprises the steps of first rinsing the wafer to form a water film over the wafer surface, followed by liquid phase etching. The water film helps the subsequent viscous etchant to be spread across the wafer surface more uniformly to thereby improve the etch uniformity.

REFERENCES:
patent: 3630804 (1971-12-01), Coffman et al.
patent: 5007981 (1991-04-01), Kawasaki et al.
patent: 5078832 (1992-01-01), Tanaka
patent: 5135608 (1992-08-01), Okutani
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5275695 (1994-01-01), Chang et al.
patent: 5279704 (1994-01-01), Saito
patent: 5487398 (1996-01-01), Ohmi et al.
patent: 5488964 (1996-02-01), Murakami et al.
patent: 5620611 (1997-04-01), Datta et al.

Affiliated with

Also associated with

Rating

Method for improving etch uniformity during a wet etching proces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for improving etch uniformity during a wet etching proces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for improving etch uniformity during a wet etching proces will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2097070