Method for improving distribution of underfill between a flip ch

Details Method for improving distribution of underfill between a flip ch Method for improving distribution of underfill between a flip ch

1995-10-16

1997-07-15

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174260, 257787, H05K 334

Patent

active

056471238

ABSTRACT:
A method and apparatus improves a distribution of an underfill material (504) applied between a flip chip die (202) and a circuit board (310) at a flip chip site (302) having a solder mask (308). An aperture (304) is formed (806) in the solder mask (308) by removing a predetermined majority of the solder mask (308) from the circuit board (310) within the flip chip site (302) before mounting the flip chip die (202). Then the flip chip die (202) is mounted (810) to the flip chip site (302). The underfill material (504) is then applied (812, 814, 816) such that the underfill material (504) flows into the aperture (304), thus improving the distribution of the underfill material (504).

REFERENCES:
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5203076 (1993-04-01), Banesji et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5245750 (1993-09-01), Crumly et al.

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