Method for improving adhesion to polymide surfaces

Details Method for improving adhesion to polymide surfaces Method for improving adhesion to polymide surfaces

1991-06-10

1993-05-25

Lusigan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, C23C 2600

Patent

active

052138402

ABSTRACT:
The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.

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Kukanskis, Improved Smear Removal, Mar. 1983.
R. Cannizzaro "Application of Polyimide Materials in Electronic Circuitry" Solid State Technology, Nov. 1969, pp. 31-38.
John Davey "Plasma desmearing" Finishing Industries, Aug., 1981, pp. 33-34.

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