Method for improving adhesion between a polyimide layer and a me

Details Method for improving adhesion between a polyimide layer and a me Method for improving adhesion between a polyimide layer and a me

1988-06-03

1992-04-14

Herbert, Jr., Thomas J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

4273831, 427404, 4274191, 4274198, 428458, 4284735, B32B 1504, B32B 2704, B05D 136

Patent

active

051047349

ABSTRACT:
The adhesion between a polyimide layer and a metal is improved by providing a layer of a metal benzotriazole on a polyamic acid layer wherein the metal is copper, silver, or gold. A layer of metal is then provided on the metal benzotriazole layer.

REFERENCES:
patent: 4109052 (1978-08-01), Anderson
patent: 4386116 (1983-05-01), Nair et al.
patent: 4508766 (1985-04-01), Inaike et al.
patent: 4517254 (1985-05-01), Grapentin et al.
patent: 4526807 (1985-07-01), Auerbach
patent: 4598022 (1986-07-01), Haque et al.
Khor, et al., "Additive Selection Criteria for Metal-Doped Polyimides", Journal of Polymer Science: Part C: Polymer Letters, vol. 25, 471-475 (1987).

Affiliated with

Also associated with

Rating

Method for improving adhesion between a polyimide layer and a me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for improving adhesion between a polyimide layer and a me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for improving adhesion between a polyimide layer and a me will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2348307