Method for improving a semiconductor substrate having SiGe...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C438S478000, C438S758000, C438S766000, C257SE21525

Reexamination Certificate

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10639647

ABSTRACT:
A method of improving a semiconductor substrate including a SiGe film on a Si or SOI substrate is provided. The method includes determining a relationship between a film condition of the SiGe film and a hydrogen ion implantation condition used in making the SiGe film so as to achieve relaxation of lattice distortion in the SiGe film as well as improved crystallinity and/or surface condition of the SiGe film, so that improved conditions for improving quality of the SiGe film on the Si or SOI substrate can be determined.

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Trinkaus et al., “Strain Relaxation Mechanism for Hydrogen-Implanted Si1-xGex/Si(100) Heterostructures,” Applied Physics Letters, vol. 76, No. 24, Jun. 12, 2000, pp. 3552-3554.
EP Search Report dated Apr. 27, 2006 for application EP 03 01 8848.
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“Strain relaxation of pseudomorphic Si1-xGex/Si(100) heterostructures after hydrogen or helium ion implantation for virtual substrate fabrication”, Hollander et al., Nuclear Instruments and Methods in Physics Research B 175-177 (2001) 357-367.
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