Method for improving a physical property defect value of a...

Details Method for improving a physical property defect value of a... Method for improving a physical property defect value of a...

2005-03-22

2005-03-22

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S474000

Reexamination Certificate

active

06869862

ABSTRACT:
The present invention provides a method for improving a physical property of a substrate, a method for manufacturing an integrated circuit, and an integrated circuit manufactured using the aforementioned method. In one aspect of the invention, the method for improving a physical property of a substrate includes subjecting the substrate to effects of a plasma process830, wherein the substrate has a physical property defect value associated therewith subsequent to the plasma process. The method further includes exposing the substrate to an ultraviolet (UV) energy source840to improve the physical property defect value.

REFERENCES:
patent: 5596218 (1997-01-01), Soleimani et al.
patent: 6456104 (2002-09-01), Guarin et al.
patent: 6521469 (2003-02-01), La Rosa et al.
patent: 6544853 (2003-04-01), Lin
patent: 6653856 (2003-11-01), Liu
patent: 6780720 (2004-08-01), Burnham et al.
patent: 6780730 (2004-08-01), Lin

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